Microelectronics Packaging Materials Database (MPMD)
- Microelectronics Packaging Materials Database (MPMD)
- Most current edition. (CINDAS)
- Updated continually. Contains data and information on thermal, mechanical, electrical and physical properties of electronics packaging materials. Provides a unique source of reliable materials properties data for the support of leading-edge packaging design and manufacturing.
Developed by CINDAS under the sponsorship of the Semiconductor Research Corporation (SRC).
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- User Guides
- http://ezproxy.lib.utexas.edu/login?url=https://cindasdata.com/Applications/Tutorials/MPMD-Tutorial.pdf
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- Usage Rights
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- User Limits: unlimited
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- Related Subjects
- Chemistry
- Civil and Architectural Engineering
- Electrical and Computer Engineering
- Engineering
- Materials Science
- Mechanical Engineering
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- Related Types
- Handbooks
- Societies/Associations/Organizations
