The University of Texas




Full Text

Mobile Access

Title begins with:
0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Find an Article from a Citation

Database News

Access Privileges

Common Problems with Off Campus Access

Report a Problem

Microelectronics Packaging Materials Database (MPMD)

Microelectronics Packaging Materials Database (MPMD)
Access the Database

Most current edition. (CINDAS) limited to students, faculty, and staff of the University of Texas at Austin fulltext of articles available
Updated continually. Contains data and information on thermal, mechanical, electrical and physical properties of electronics packaging materials. Provides a unique source of reliable materials properties data for the support of leading-edge packaging design and manufacturing.

Developed by CINDAS under the sponsorship of the Semiconductor Research Corporation (SRC).

User Guides
Usage Rights
User Limits: unlimited
Related Subjects
Civil and Architectural Engineering
Electrical and Computer Engineering
Materials Science
Mechanical Engineering
Related Types




Perry-Castañeda Library
101 East 21st St.
Austin, TX. 78713

Phone: (512) 495-4350

Connect with UT Libraries

Facebook Twitter Instagram Tumblr Google Plus Flickr Pinterest YouTube

© The University of Texas at Austin 2016   UTDIRECT