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Microelectronics Packaging Materials Database (MPMD)


Microelectronics Packaging Materials Database (MPMD)
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Most current edition. (CINDAS) limited to students, faculty, and staff of the University of Texas at Austin fulltext of articles available
Updated continually. Contains data and information on thermal, mechanical, electrical and physical properties of electronics packaging materials. Provides a unique source of reliable materials properties data for the support of leading-edge packaging design and manufacturing.

Developed by CINDAS under the sponsorship of the Semiconductor Research Corporation (SRC).

 
 
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http://ezproxy.lib.utexas.edu/login?url=https://cindasdata.com/Applications/Tutorials/MPMD-Tutorial.pdf
 
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User Limits: unlimited
 
Related Subjects
Chemistry
Civil and Architectural Engineering
Electrical and Computer Engineering
Engineering
Materials Science
Mechanical Engineering
 
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Handbooks
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